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  Created by: Matti

Design case 1: Coupled Domain Simulations of MEMS

Numerical damping analysis based on Reynold's squeeze film equation:
Numerical damping analysis based on Reynold's squeeze film equations

Dissipative effects at microstructures are mainly caused by viscose gas damping in the gap
between movable structure and substrate. Damping parameter can be determined from the
real and imaginary part of the pressure response obtained for the eigenmodes of the structure.

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