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Design case 2: Reduced Order Modeling of Coupled Systems Simulation results:    Influence of thermal and intrinsic stress Latest developments allow to consider varying thermal and intrinsic stress during operation. As result the cantilever curls out of the wafer plane as shown on above picture. As soon as the curvature of the cantilever reaches a critical level, the movable structure touches the insulation layer of the driving electrode without closing the contact at the paddle. First page    Previous page    Next page